黄山谷捷(301581.SZ)：公司生产的铜散热基板主要为SiC模块和IGBT模块解决散热问题

Group 1 - The core viewpoint of the article is that Huangshan Valley Jiejie (301581.SZ) is focusing on the production of copper heat dissipation substrates, which are primarily used to address heat dissipation issues for SiC modules and IGBT modules in the context of the 800V high-voltage platform [1] Group 2 - The mainstream power devices paired with the 800V high-voltage platform are SiC modules and IGBT modules [1] - The company's copper heat dissipation substrates are specifically designed to solve the heat dissipation problems associated with these power devices [1]