快克智能(603203.SH)：TCB热压键合设备目前针对HBM堆叠工艺进行开发

Core Viewpoint - The company is developing TCB (Thermal Compression Bonding) equipment specifically for HBM (High Bandwidth Memory) stacking processes, with future iterations planned based on specific applications of HBF (High Bandwidth Fabric) [1] Group 1 - The structures of HBF and HBM are similar, both relying on Chiplet heterogeneous integration, CoWoS (Chip-on-Wafer-on-Substrate) packaging, and 3D stacking [1] - The company's TCB equipment is currently focused on the development for HBM stacking technology [1]