黄仁勋：将发布“世界前所未见”的新芯片，“所有技术都逼近极限”

Core Insights - Nvidia's CEO Jensen Huang announced in an interview that the upcoming GTC 2026 conference will unveil "unprecedented" new chips [1] - Huang expressed confidence in the team's efforts to tackle the challenges posed by the next-generation AI accelerator, Vera Rubin, and the critical HBM4 component supplied by SK Hynix [1] - Huang stated that the current AI landscape does not exhibit a bubble, emphasizing that it marks the beginning of a massive infrastructure project worth trillions of dollars [1] Group 1 - Huang dined with over 30 engineers from SK Hynix and Nvidia, highlighting collaboration between the two companies [1] - The HBM4 component is seen as crucial for the performance of Nvidia's Vera Rubin AI accelerator, amidst fierce competition with Samsung Electronics [1] - Huang did not disclose specific models of the new chips but hinted they may belong to the Rubin series or the next-generation Feynman series [1][2] Group 2 - The Rubin series has already been showcased at the 2026 CES, featuring six new chip designs that are now in full production [1] - The Feynman series is described as a "revolutionary" product, with Nvidia exploring extensive integration based on SRAM or 3D stacking technology for LPUs, though details remain unconfirmed [2]