飞凯材料(300398.SZ)：自主研发的半导体先进封装用厚膜负性光刻胶已完成验证且正在向客户端导入

Core Viewpoint - The rapid development of data centers, advanced packaging, storage chips, AI chips, and artificial intelligence presents significant opportunities for the related materials industry [1] Group 1: Advanced Packaging - The company has established a comprehensive product matrix in the advanced packaging sector [1] - The Ultra Low Alpha Microball, with a minimum diameter of 50μm, addresses material bottlenecks for advanced packaging substrates [1] - The company has developed a product system for temporary bonding materials, primarily based on thermal and mechanical debonding, with laser debonding as a supplementary method [1] - The self-developed thick negative photoresist for semiconductor advanced packaging has completed validation and is being introduced to clients, compatible with 2.5D/3D advanced packaging processes [1] Group 2: Material Coverage - The existing MUF materials cover liquid packaging materials LMC and GMC particle packaging materials [1] - The company has also laid out products in semiconductor manufacturing and advanced packaging, including solder balls, epoxy encapsulants, photoresists, and wet process electronic chemicals such as developers, etchants, strippers, and plating solutions [1] Group 3: UV Curing Materials - After over twenty years of development, the company has gradually mastered several core technologies for UV curing coating materials [1] - The company has achieved advanced domestic technology in the synthesis of UV curing resin [1]