TFME(002156) Huajin Securities·2024-09-02 14:30Investment Rating - The investment rating for Tongfu Microelectronics (002156.SZ) is maintained at "Buy-A" [1][2]. Core Views - The company has shown significant performance improvement in Q2 2024, driven by growth in high-performance packaging for AI chips. The revenue from mid-to-high-end products has notably increased, leading to a turnaround in net profit for H1 2024 [1][2]. - The global semiconductor industry is experiencing a clear recovery, with the company actively enhancing its capacity utilization and revenue growth, particularly in mid-to-high-end products. The overall efficiency of the company has improved significantly due to better management and cost control [1][2]. - The AI chip market is rapidly expanding, with Gartner predicting a 33% increase in the global AI chip market size in 2024, reaching $71.3 billion, and further growth expected in subsequent years [1][2]. Financial Performance - In H1 2024, the company achieved revenue of 11.08 billion yuan, a year-on-year increase of 11.83%, and a net profit of 323 million yuan, marking a turnaround from a net loss of 188 million yuan in H1 2023. In Q2 2024, revenue reached 5.798 billion yuan, a year-on-year increase of 10.10% and a quarter-on-quarter increase of 9.77%, with a net profit of 224 million yuan, up 216.61% year-on-year and 127.60% quarter-on-quarter [1][2]. - The company expects revenue for 2024 to be 25.28 billion yuan, with a growth rate of 13.5%, and net profit to reach 957 million yuan, reflecting a significant increase of 465.0% [2][3]. Market Outlook - The demand for advanced packaging in the AI chip sector is expected to rise due to the increasing need for high-performance chips. The company is well-positioned to benefit from its long-standing partnerships with industry leaders like AMD, which is experiencing strong growth in its data center business [1][2]. - The company is actively expanding its production capacity, with several major projects underway, including new factories and production lines, to meet the growing demand for advanced packaging solutions [2][3].