JCET(600584) 华源证券·2025-05-27 15:03Investment Rating - The report assigns an "Accumulate" rating for the company, marking its first coverage [4]. Core Views - The company is a leading player in the semiconductor packaging and testing industry, benefiting from the recovery of industry conditions and its advanced packaging layout, which promises growth potential [4]. - The company ranks third globally among OSAT manufacturers and first in mainland China, indicating its strong market position [4]. - The company's proprietary XDFOI®Chiplet technology has achieved stable mass production, catering to high-performance computing, AI, 5G, and automotive electronics [4]. - The automotive electronics market presents significant growth opportunities, with the company expected to see rapid development following the launch of its new factory in Shanghai [4][6]. Financial Summary - Revenue projections for the company are as follows: - 2023: 29,661 million RMB - 2024: 35,962 million RMB (21.24% YoY growth) - 2025: 42,865 million RMB (19.20% YoY growth) - 2026: 47,361 million RMB (10.49% YoY growth) - 2027: 52,999 million RMB (11.90% YoY growth) [5]. - Net profit forecasts are: - 2023: 1,471 million RMB - 2024: 1,610 million RMB (9.44% YoY growth) - 2025: 2,078 million RMB (29.11% YoY growth) - 2026: 2,900 million RMB (39.56% YoY growth) - 2027: 3,967 million RMB (36.77% YoY growth) [5]. - The company's earnings per share (EPS) are projected to increase from 0.82 RMB in 2023 to 2.22 RMB in 2027 [5]. Investment Valuation - The current price-to-earnings (P/E) ratios are projected to decrease from 39.90 in 2023 to 14.79 in 2027, indicating an attractive valuation as earnings grow [5][6]. - The report compares the company with peers such as Tongfu Microelectronics, Huatian Technology, and Nexperia, with an average valuation of 39.29 times for 2025 [6].