TSMC(US:TSM) GOLDEN SUN SECURITIES·2025-08-11 03:48Investment Rating - The report maintains a rating of "Buy" for relevant stocks in the advanced packaging industry [4][8]. Core Insights - The semiconductor market is expected to reach a valuation of $1 trillion by 2030, driven by AI and HPC, with AI terminals projected to account for 45% of the market share [1][12]. - Advanced packaging technologies, particularly CoWoS, are critical for enhancing chip performance and efficiency, with significant upgrades planned for the coming years [2][70]. - Domestic suppliers in the advanced packaging supply chain are poised for growth due to increasing demand and limited overseas capacity [3]. Summary by Sections Semiconductor Market Outlook - AI is set to lead a new growth cycle in the semiconductor market, transitioning from previous drivers like PCs and smartphones [12]. - TSMC projects a threefold increase in energy-efficient performance (EEP) every two years through process upgrades and advanced packaging innovations [15]. Advanced Packaging Technology - CoWoS technology enables high-density chip integration, significantly improving performance and reducing power consumption [70]. - TSMC's advanced packaging platforms, including CoWoS and SoW, are evolving to meet the increasing demands of AI and HPC applications [53][62]. Demand and Supply Dynamics - Major cloud service providers like Google, Meta, and Amazon are increasing their capital expenditures, indicating a robust demand for AI-related technologies [2]. - The supply of CoWoS is currently insufficient to meet demand, prompting TSMC to expand its production capacity [2][3]. Domestic Supply Chain Opportunities - The report highlights the importance of a self-sufficient domestic CoWoS supply chain in China, as local manufacturers enhance their capabilities [3]. - The rapid expansion of advanced packaging capacity is expected to drive growth in the domestic semiconductor supply chain [3].