德邦科技（688035）：泰吉诺并表，拓展高端导热界面材料在算力等领域布局：集成电路封装材料进入快速成长期

Investment Rating - The report maintains an "Accumulate" rating for Debang Technology with a target price of 74.20 CNY [5][13]. Core Insights - The company has experienced rapid growth in integrated circuit packaging materials and smart terminal packaging materials, with revenues increasing by 87.79% and 53.07% year-on-year, respectively [2][11]. - The acquisition of Taijino, which will be consolidated starting February 2025, is expected to enhance the company's position in high-end thermal interface materials for high computing power and advanced packaging applications [2][11]. - The company’s revenue for the first half of 2025 reached 690 million CNY, a year-on-year increase of 49.02%, with a net profit of 44.29 million CNY, up 53.47% [11][12]. Financial Summary - Total revenue projections for 2025E, 2026E, and 2027E are 1.59 billion CNY, 1.95 billion CNY, and 2.35 billion CNY, representing year-on-year growth rates of 36.25%, 22.70%, and 20.69% respectively [13]. - The net profit attributable to the parent company for the same years is projected to be 150 million CNY, 215 million CNY, and 282 million CNY, with growth rates of 54.31%, 42.83%, and 31.31% respectively [13]. - The company’s earnings per share (EPS) for 2025E, 2026E, and 2027E are estimated at 1.06 CNY, 1.51 CNY, and 1.98 CNY [11][13]. Revenue Breakdown - The revenue from integrated circuit packaging materials in the first half of 2025 was 113 million CNY, with a gross margin of 42.89%, an increase from 39.21% in the first half of 2024 [11]. - Revenue from smart terminal packaging materials was 167 million CNY, with a gross margin of 43.05% [11]. - Revenue from new energy application materials reached 359 million CNY, with a gross margin of 13.05% [11]. Market Position and Growth Drivers - The company has successfully delivered small batches of several advanced packaging materials, including DAF film, CDAF film, and chip-level underfill materials [11]. - The acquisition of Taijino is expected to further expand the company’s capabilities in high-end thermal interface materials [11]. - The company is also penetrating core modules for major smartphone clients, indicating strong demand and market validation [11].