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兴森科技(002436):25H1营收净利润实现双增长,稳步推进IC封装基板业务技术提升

Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index in the next six months [4][16]. Core Views - The company achieved revenue and net profit growth in the first half of 2025, with revenue reaching 3.426 billion yuan, a year-on-year increase of 18.91%, and net profit of 29 million yuan, up 47.85% year-on-year [2][3]. - The semiconductor business, particularly the IC packaging substrate segment, is a focus area for technological enhancement and customer expansion, with revenue from this segment growing by 36.04% year-on-year [3][8]. - The company is optimistic about future performance due to ongoing product upgrades and increasing capacity utilization, projecting net profits of 93 million yuan, 280 million yuan, and 742 million yuan for 2025, 2026, and 2027 respectively [8]. Financial Performance Summary - Revenue is projected to grow from 5.36 billion yuan in 2023 to 10.57 billion yuan in 2027, with a compound annual growth rate (CAGR) of 25.1% [1]. - The net profit is expected to recover from a loss of 198 million yuan in 2024 to a profit of 742 million yuan by 2027, reflecting significant growth rates in subsequent years [1][8]. - The company's return on equity (ROE) is forecasted to improve from 2.0% in 2023 to 11.1% in 2027, indicating enhanced profitability [1][8]. Business Segment Insights - The PCB business generated 2.448 billion yuan in revenue, with a gross margin of 26.32%, while the semiconductor segment achieved 831 million yuan in revenue, marking a 38.39% increase [2][3]. - The CSP packaging substrate business is expanding into high-value markets, including automotive, with increasing capacity utilization and a focus on high-end products [3]. - The company is actively pursuing both domestic and international clients to enhance its market presence and secure future production opportunities [3].