兴森科技(002436):AI带来行业新动能,载板业务前景广阔

Investment Rating - The report maintains a "Buy-A" investment rating with a target price of 25.25 CNY for the next six months [4][8]. Core Insights - The company reported a revenue of 5.373 billion CNY for the first three quarters of 2025, representing a year-on-year growth of 23.48%, and a net profit of 131 million CNY, up 516.08% [1]. - In Q3 2025, the company achieved a revenue of 1.947 billion CNY, a year-on-year increase of 32.42%, with a gross margin of 22.36% [2]. - The PCB industry is experiencing a recovery driven by AI, a rebound in storage chips, and a revival in consumer electronics, leading to a more favorable market environment [2]. - The company is making progress in its ABF substrate business, with losses narrowing and both revenue and profit showing growth [2]. Financial Projections - Revenue projections for the company are 7.155 billion CNY, 8.944 billion CNY, and 11.270 billion CNY for 2025, 2026, and 2027 respectively, with net profits expected to be 185 million CNY, 438 million CNY, and 868 million CNY in the same years [4][14]. - The company’s FCBGA packaging substrate project has an investment scale exceeding 3.8 billion CNY, with significant improvements in technical capabilities and production yield [3]. Market Position and Strategy - The company is focusing on expanding its domestic customer base while also targeting overseas clients to secure future production opportunities [3]. - The FCBGA packaging substrate market is currently dominated by Taiwanese suppliers, indicating a significant opportunity for domestic alternatives [3].