Investment Rating - The report assigns an IPO-specific rating of 5.1 out of 10 for the company, based on operational performance, industry outlook, valuation, and market sentiment [7]. Core Insights - The company is a leading manufacturer of self-produced silicon carbide (SiC) epitaxial wafers, with a significant market share in China and globally. It has achieved mass production of 4-inch, 6-inch, and 8-inch wafers, with the 6-inch wafers being the core product [1][3]. - The company is positioned as the largest self-produced SiC epitaxial wafer manufacturer in China and the third largest globally, with a revenue market share of 30.6% in China and 6.7% globally for 2024 [1][3]. - The demand for SiC wafers is driven by high-growth sectors such as electric vehicles and power supply, indicating a clear long-term demand support [1][4]. Company Overview - The company has a production capacity of 420,000 wafers per year as of May 2025, with a new production base expected to be operational by the end of 2025, further consolidating its scale advantage [1][4]. - Financial performance shows revenue growth from 437 million yuan in 2022 to 1.171 billion yuan in 2023, but a projected loss of 500 million yuan in 2024. However, in the first five months of 2025, revenue was 257 million yuan, showing a 13.6% year-on-year decline, but net profit turned positive at 9.515 million yuan [2][11]. Industry Status and Outlook - The global market for self-produced SiC epitaxial wafers is expected to grow, with the company capturing a significant share. The industry is characterized by high demand due to the properties of SiC, which are suitable for high-temperature and high-voltage applications [3][4]. - The company benefits from the "new infrastructure" policy in China, which supports semiconductor localization, positioning it favorably for future growth [4]. Strengths and Opportunities - The company has a strong market position as the largest domestic manufacturer of SiC epitaxial wafers, with a significant production capacity and ongoing expansion plans [4]. - It has a robust R&D capability with 84 patents, including 33 invention patents, and is involved in multiple national and international standard-setting projects [4]. - The increasing demand from sectors like electric vehicles and power equipment is expected to drive growth, particularly for 8-inch products, which are becoming mainstream due to their efficiency advantages [4]. Weaknesses and Risks - The average selling price of the 6-inch wafers has decreased significantly from 9,631 yuan per piece in 2022 to 3,138 yuan in the first five months of 2025, which poses a challenge to revenue [5]. - The company faces ongoing capital expenditure pressures, with a cumulative investment of 2.45 billion yuan from 2022 to 2024, and plans for further significant investments in capacity expansion [5].
天域半导体（02658）：IPO点评