景嘉微(300474):边端侧AI芯片完成点亮,通用市场转型提速

Investment Rating - The report maintains an "Accumulate" rating for the company [2][5]. Core Views - The company has achieved a milestone in the smart computing chip sector with the successful development of the CH37 series AI SoC chip, which has completed various stages including tape-out, packaging, and lighting up [2][4]. - The CH37 series chip features high-performance computing capabilities, achieving a peak AI computing power of 64 TOPS@INT8, and is designed for real-time operation in complex visual recognition and decision-making models [3][4]. - The company is transitioning from a specialized market focused on military graphics to a broader general market that includes artificial intelligence and data centers, with the CH37 series being a key product in this strategic shift [4][5]. Financial Projections - The company is projected to achieve revenues of 752 million yuan in 2025, 1.105 billion yuan in 2026, and 1.553 billion yuan in 2027, reflecting significant growth rates of 61%, 47%, and 41% respectively [2][5]. - The net profit is expected to recover from a loss of 165 million yuan in 2024 to a profit of 14 million yuan in 2025, and further increase to 90 million yuan in 2026 and 211 million yuan in 2027 [2][5]. - The report highlights a significant increase in R&D investment, with R&D expense ratios projected at 60.2% for 2024 and 46.8% for the first three quarters of 2025, indicating a strong commitment to innovation [5]. Market Position and Strategy - The CH37 series is positioned to meet the high computing demands of embodied intelligence and edge computing markets, applicable in various scenarios such as robotics, AI boxes, smart terminals, and drones [3][4]. - The company aims to leverage its high-performance chip capabilities to expand into new markets, including smart cities and industrial vision applications [3][4]. - The strategic transformation is expected to lead to a reversal of the company's previous operational challenges, with the successful launch of the CH37 series laying the groundwork for future testing and mass production [5].