声明：市场有风险，投资需谨慎。本文基于第三方数据库自动发布，不代表新浪财经观点，任何在本文 出现的信息均只作为参考，不构成个人投资建议。如有出入请以实际公告为准。如有疑问，请联系 biz@staff.sina.com.cn。 2月4日，景嘉微跌0.01%，成交额6.04亿元。两融数据显示，当日景嘉微获融资买入额8744.31万元，融 资偿还9512.87万元，融资净买入-768.56万元。截至2月4日，景嘉微融资融券余额合计17.50亿元。 截至1月20日，景嘉微股东户数9.10万，较上期减少2.71%；人均流通股4464股，较上期增加2.78%。 2025年1月-9月，景嘉微实现营业收入4.95亿元，同比增长12.14%；归母净利润-7253.34万元，同比减少 403.81%。 分红方面，景嘉微A股上市后累计派现3.92亿元。近三年，累计派现1.41亿元。 机构持仓方面，截止2025年9月30日，景嘉微十大流通股东中，易方达创业板ETF（159915）位居第六 大流通股东，持股675.19万股，相比上期减少113.42万股。南方中证500ETF（510500）位居第八大流通 股东，持股456.06万股，相 ...

证券日报网讯2月4日，景嘉微（300474）在互动平台回答投资者提问时表示，目前公司产品广泛应用于 高可靠性要求的航空、航天、航海、车载等专用领域及通用领域。 ...

证券日报网讯 2月4日，景嘉微在互动平台回答投资者提问时表示，公司将密切关注相关技术发展趋势 及行业产业政策，持续推动芯片迭代优化以及生态体系建设，助力打造具备安全可控性能的国产化算力 底座。 （文章来源：证券日报） ...

证券日报网讯2月4日，景嘉微（300474）在互动平台回答投资者提问时表示，2023年度，公司研发投入 3.31亿元，占公司营业收入的比例46.44%；2024年度，公司研发投入2.81亿元，占公司营业收入的比例 60.18%；2025年前三季度公司研发投入2.34亿元，占公司营业收入的比例47.41%。公司的研发投入主要 集中于GPU芯片、图形显控、小型专用化雷达及相关技术领域。 ...

证券日报网讯2月4日，景嘉微（300474）在互动平台回答投资者提问时表示，公司直接持有诚恒微 34.65%的股权，并通过一致行动关系，合计取得诚恒微66.93%的表决权，成为诚恒微的控股股东，诚 恒微将成为公司的控股子公司。 ...

证券日报网讯2月4日，景嘉微（300474）在互动平台回答投资者提问时表示，截至2026年1月20日，公 司股东总户数为91045户。 ...

Core Viewpoint - The company is significantly increasing its research and development (R&D) investment, indicating a strong focus on innovation and technology advancement in the GPU and radar sectors [1] Group 1: R&D Investment - In 2023, the company's R&D expenditure was 331 million yuan, accounting for 46.44% of its operating revenue [1] - For 2024, the R&D investment is projected to be 281 million yuan, which will represent 60.18% of the operating revenue [1] - In the first three quarters of 2025, the R&D spending reached 234 million yuan, making up 47.41% of the operating revenue [1] Group 2: R&D Focus Areas - The primary focus areas for the company's R&D efforts include GPU chips, graphics display control, and small specialized radar technologies [1] Group 3: Future Profitability - The company has not provided specific details regarding its profitability for the year 2016, suggesting that further information will be available through official announcements [1]

格隆汇2月4日丨景嘉微(300474.SZ)在互动平台表示，目前公司产品广泛应用于高可靠性要求的航空、 航天、航海、车载等专用领域及通用领域。 ...

◎记者 夏子航 上海证券报记者注意到，"十大技术攻关项目"清单包括：量超智多元异构融合跨域混算关键技术及示范 应用；精密电子制造具身智能机器人研制与应用；非圆岩石隧道全断面智能掘进装备关键技术研究与应 用；低空飞行器高功率密度电推进系统研发；12英寸低压化学气相沉积设备开发及应用；道地药材AI 育种共性技术研究与示范；高新视听全链路云制作关键技术研发及应用；具身智能机器人多模态高性能 SOC芯片研发；量子北斗可信导航关键技术研发及产业化；高密度高可靠多层PCB关键技术研究。 "十大技术攻关项目"背后，有着多家湖南本地上市公司的力挺。 例如，2025年12月底，AI硬件龙头企业蓝思科技旗下蓝思智能永安新园区启用后，实现首批、超600台 整机组装机器人正式量产交付。蓝思科技表示，规模化交付得益于湖南浏阳永安基地新增产能的释放和 自动化产线逐步投产。该基地设计年产能可达1万台/套大型自动化设备及50万台具身智能机器人，具备 从结构件、核心部件到整机的完整垂直制造链条。此外，近期景嘉微控股子公司诚恒微自主研发的边端 侧AI SoC芯片CH37系列顺利完成流片、封装、回片及点亮等关键阶段工作，可以涵盖机器人、智能终 端 ...

Core Insights - The global High Bandwidth Memory (HBM) market is experiencing rapid growth, with shipments expected to increase from 1.5 billion gigabytes (GB) in 2023 to 5.7 billion GB by 2026, and revenues projected to rise from $4.35 billion in 2023 to $50 billion in 2026 [6][7][8]. HBM Industry Definition and Advantages - HBM is a high-performance semiconductor memory based on 3D stacking technology, offering high bandwidth and energy efficiency, primarily used in high-performance computing and networking applications [1][4]. - HBM has four main advantages over traditional DRAM: high bandwidth, high capacity, low power consumption, and small size [2][3]. HBM Industry Development Status - HBM technology is becoming a standard for AI acceleration cards (GPUs, TPUs, etc.), with its value share continuing to increase [4][6]. - The demand for HBM is driven by the needs of AI and high-performance computing, with significant growth expected in the coming years [6][10]. HBM Industry Chain - The HBM industry chain includes upstream materials (electrolytes, precursors, IC substrates) and semiconductor equipment (lithography machines, etching machines), with midstream focusing on HBM production and downstream applications in AI, data centers, and high-performance computing [8][9]. HBM Industry Competitive Landscape - The global HBM market is dominated by foreign manufacturers, with SK Hynix holding a 53% market share, followed by Samsung at 38% and Micron at 9% [14][15]. - Domestic companies in China, such as Changxin Memory, Changdian Technology, and others, are making significant progress in the HBM supply chain, aiming to increase local production capabilities [15][16]. HBM Industry Development Trends - HBM is positioned as a critical hardware component for AI and high-performance computing, with its unique 3D stacked structure providing superior bandwidth compared to traditional memory solutions [16][17]. - The future memory landscape will be heterogeneous, with HBM focusing on training scenarios, while other memory types will cater to specific workloads, creating a diverse memory ecosystem for the AI era [17].