重磅技术，英伟达延迟采用

Core Viewpoint - Nvidia has postponed the commercialization of its next-generation low-power DRAM module, SOCAMM, shifting its focus from the initially targeted Blackwell series to the Rubin series, in response to challenges in ensuring stable production and performance amid the rapid advancements in AI accelerator technology [1][4][5]. Summary by Sections SOCAMM Development and Supply Chain - SOCAMM is designed to integrate four LPDDR low-power DRAMs to enhance power efficiency and is removable for easier upgrades and maintenance [1]. - Major memory partners, including Samsung, SK Hynix, and Micron, have adjusted their SOCAMM supply plans following Nvidia's notification about the change in application timeline [1][4]. Changes in GB300 Design - The GB300, initially set to incorporate SOCAMM, has undergone a design change from the Cordelia motherboard to the Bianca design, which does not support SOCAMM and instead uses existing LPDDR memory [2][3]. - The Cordelia design was intended to support two Grace CPUs and four Blackwell GPUs, while the Bianca design only supports one Grace CPU and two Blackwell GPUs [3]. Reliability and Production Challenges - The switch to the Bianca design was influenced by reliability issues with the Cordelia design, which was prone to data loss, and similar reliability concerns with SOCAMM, including heat dissipation problems [3][4]. - Nvidia is facing supply chain difficulties, impacting its ability to manage production yields, prompting a reliance on existing technologies to mitigate these issues [3][5]. Market Impact and Future Prospects - The postponement of SOCAMM is seen as a strategy to avoid excessive technological advancement while ensuring product reliability and timely market entry [4]. - Micron's SOCAMM modules, which are now in mass production, are expected to provide significant performance and energy efficiency benefits for AI training and inference applications [6][8].