台积电疯狂建厂，细节曝光

Core Viewpoint - TSMC is significantly expanding its semiconductor manufacturing capacity, planning to invest between $38 billion and $42 billion by 2025 to build eight new fabs and one advanced packaging facility [1][2]. Group 1: Capacity Expansion Plans - TSMC's capital expenditure has increased fivefold since 2015, indicating a strong growth trajectory in the semiconductor market [1]. - The company plans to construct nine new facilities, including eight wafer fabs and one advanced packaging plant, to support its growth [1]. - TSMC aims to produce 30% of its 2nm and more advanced chips in the U.S., specifically at its Fab 21 in Arizona, creating a significant semiconductor manufacturing cluster [3][4]. Group 2: Specific Facility Developments - Fab 20 and Fab 22 in Taiwan are set to begin mass production of chips using TSMC's N2 process technology later this year [2]. - The construction of Fab 21 in Arizona is progressing, with plans for multiple modules to support N3, N2, and A16 chip production [3][4]. - Fab 23 in Japan and Fab 24 in Germany are also under construction, contributing to TSMC's global manufacturing footprint [2]. Group 3: Production Capacity and Timeline - TSMC's Fab 21 is expected to achieve a production capacity of at least 100,000 wafers per month, although the timeline for this goal remains uncertain [4]. - The company is working to expedite the production timeline for its second module at Fab 21, aiming to start mass production earlier than the initially planned 2028 [4]. - The construction of additional modules at Fab 21 is contingent on customer demand, with plans for modules that will utilize A16 and potentially even more advanced technologies [4].