Core Viewpoint - The company is strategically focusing on high-performance packaging technology and high-value applications, optimizing its business structure to capture growth in sectors such as automotive electronics, high-performance computing, storage, and 5G communications [2] Group 1: Business Structure and Growth Areas - The company is accelerating its strategic layout in high-value markets, with revenue distribution in 2024 projected as follows: 44.8% from communication electronics, 24.1% from consumer electronics, 16.2% from computing electronics, 7.9% from automotive electronics, and 7.0% from industrial and medical electronics. All sectors, except for industrial, are expected to achieve double-digit year-on-year revenue growth [2] - The computing electronics segment is a significant growth driver, with a 38.1% year-on-year revenue increase in 2024. The company has extensive experience in memory packaging and has acquired 80% of Shengdie Semiconductor, enhancing its market share in the storage and computing electronics sector [3] Group 2: Automotive Electronics - The company is actively engaging in the automotive electronics sector, forming strategic partnerships with leading international firms. The automotive electronics revenue is expected to grow by 20.5% year-on-year in 2024, significantly outpacing the industry average. The Shanghai automotive electronics packaging production base is under construction and is expected to commence production in the second half of 2025 [4] Group 3: Advanced Technologies and Applications - The company is expanding its capabilities in smart terminal RF, power, and energy sectors. It is developing advanced packaging technologies for 5G, WiFi RF modules, and millimeter-wave radar products. Additionally, it is advancing third-generation semiconductor power devices and modules, with its 2.5D vertical Vcore module already in mass production [5]
【长电科技(600584.SH)】运算及汽车电子构筑增长引擎——跟踪报告之五(刘凯/黄筱茜)