芯片，最新路线图

Core Viewpoint - IMEC's semiconductor roadmap predicts significant advancements in chip technology and architecture, transitioning from FinFET to NanoSheet and eventually to CFET and 2DFET, highlighting the industry's shift from size reduction to architectural innovation [2][63]. Group 1: IMEC's Role and Roadmap - IMEC is recognized as a leading authority in semiconductor research, providing valuable insights into future technology trends and serving as a reference for global semiconductor companies and research institutions [2][3]. - The updated roadmap extends to 2039, detailing the evolution of process nodes and the challenges associated with transitioning new technologies from the lab to industrial application [3][5]. Group 2: Chip Technology Evolution - Current advanced processing technologies include 7nm, 5nm, and 3nm nodes, which have become mainstream, but these numbers no longer reflect physical dimensions due to the shift to 3D transistor architectures [8][11]. - The transition from FinFET to NanoSheet architecture is anticipated as the industry faces limitations with FinFET at smaller nodes, particularly below 2nm, due to quantum tunneling effects [19][21]. Group 3: NanoSheet and Future Architectures - NanoSheet transistors utilize a gate-all-around (GAA) structure, enhancing control over the channel and mitigating leakage current issues, thus providing a pathway for improved performance and power efficiency [23][27]. - The roadmap indicates that the introduction of CFET technology will further enhance transistor density and performance by stacking n-FET and p-FET layers [44][46]. Group 4: Advanced Lithography Techniques - The transition from standard EUV lithography to High NA EUV technology is crucial for achieving the precision required for NanoSheet and CFET architectures, enabling the production of smaller feature sizes [30][33]. - Hyper NA EUV technology is expected to push lithography capabilities to atomic-level precision, essential for the manufacturing of CFETs and beyond [49][50]. Group 5: Challenges and Innovations - The semiconductor industry faces challenges such as quantum tunneling effects, the complexity of 2D material integration, and the need for advanced manufacturing techniques to support new architectures [63]. - Innovations like backside power delivery technology are being introduced to enhance chip performance by reducing electromagnetic interference and improving power efficiency [34][37].