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斯达半导拟再融资15亿元,投向SiC等3大车规器件项目

Core Viewpoint - The company plans to issue convertible bonds totaling up to RMB 150 million to optimize its capital structure, support business development, and enhance market competitiveness [1] Fund Utilization - The raised funds will be allocated to the following projects: - Automotive-grade SiC MOSFET module manufacturing project with a total investment of RMB 100.25 million, intending to use RMB 60 million from the raised funds [2] - IPM module manufacturing project with a total investment of RMB 30.08 million, intending to use RMB 27 million from the raised funds [3] - Automotive-grade GaN module industrialization project with a total investment of RMB 30.11 million, intending to use RMB 20 million from the raised funds [4] - Working capital supplementation project with a total investment of RMB 43 million, intending to use RMB 43 million from the raised funds [5] Financial Performance - The company's financial reports from 2022 to Q1 2025 show the following: - Revenue figures: RMB 270.55 million, RMB 366.30 million, RMB 339.06 million, and RMB 91.92 million [5] - Net profit figures: RMB 82.07 million, RMB 92.07 million, RMB 51.34 million, and RMB 10.49 million [5] - Debt-to-asset ratios: 19.45%, 23.44%, 30.09%, and 31.81% [5] - Current ratios: 8.91, 6.31, 3.83, and 3.62 [5] - Quick ratios: 7.70, 4.49, 2.55, and 2.36, indicating strong solvency [5]