Core Viewpoint - The article discusses the retirement of TSMC's Vice President of R&D, Dr. Yu Zhenhua, highlighting his significant contributions to the semiconductor industry, particularly in advanced packaging technologies and the establishment of TSMC as a leader in the foundry sector [3][5][7]. Group 1: Contributions of Dr. Yu Zhenhua - Dr. Yu Zhenhua joined TSMC in 1994 and played a pivotal role in the development of advanced packaging technologies such as CoWoS and InFO, which have been crucial for TSMC's success in the semiconductor industry [3][5][9]. - He has accumulated over 190 U.S. patents and 173 Taiwanese patents, focusing on low dielectric materials and packaging integration technologies [9]. - Dr. Yu's leadership in the development of 3D chip integration and TSV technology has strengthened the Taiwanese semiconductor supply chain [9]. Group 2: Transition of Leadership - Following Dr. Yu's retirement, his responsibilities will be taken over by Xu Guojin, who has over 30 years of experience in the semiconductor industry and previously held senior positions at Micron [5][11][13]. - Xu Guojin is currently the Vice President of Integrated Interconnect & Packaging at TSMC, focusing on 3D IC and advanced packaging technologies [13]. Group 3: Historical Context and Achievements of TSMC - TSMC's rise to prominence in the semiconductor industry is attributed to key technological breakthroughs, including the 0.13-micron copper process developed in 2003, which significantly enhanced its market position [16][17]. - The article refers to the "Six Knights of TSMC," a group of key figures, including Dr. Yu, who have been instrumental in TSMC's technological advancements and overall success [15][17][22]. - TSMC's focus on advanced packaging has become a major area of growth, with the establishment of the "3D Fabric" brand for its 2.5D and 3D packaging products [25].
台积电先进封装奠基人:余振华退休