ASIC重塑HBM供应链

Core Viewpoint - The demand for custom AI semiconductors is rapidly increasing, leading to a shift in the customer base for high bandwidth memory (HBM) from traditional GPU manufacturers like Nvidia and AMD to tech giants such as Amazon, Google, and Meta, who are designing their own ASICs [1][2]. Group 1: Market Dynamics - The shift in demand is prompting memory chip manufacturers like Samsung, SK Hynix, and Micron to adjust their supply strategies and increase production capacity for HBM targeted at ASIC developers [1]. - Micron has identified ASIC platform companies alongside Nvidia and AMD as its four major HBM customers, indicating the growing influence of this sector [1]. - Analysts predict that by 2026, global shipments of AI ASICs will surpass those of Nvidia's AI chips, with the global ASIC AI market expected to reach $30 billion this year, growing at over 30% annually [1]. Group 2: HBM Supply and Technology - The demand for HBM is increasing as it is crucial for handling high-speed data in AI workloads, with SK Hynix supplying significant volumes to Amazon, Google, and Broadcom [2]. - Samsung is delivering its fifth-generation HBM3E to Broadcom and other ASIC customers, while the upcoming sixth-generation HBM4 technology is expected to bring further changes, allowing for customized logic chips [2]. - Samsung and SK Hynix are accelerating investments in HBM4 production to meet the rising demand, with Micron also providing samples of 12-layer HBM4 chips for quality verification [2]. Group 3: Future Agreements - HBM orders typically require a year of advance booking, and it is anticipated that the three major suppliers will finalize sample agreements with ASIC customers by the end of the year [3].