博通叫停西班牙十亿美元芯片工厂计划

Core Viewpoint - Broadcom has officially terminated its plan to invest approximately $1 billion in a semiconductor packaging and testing factory in Spain, marking a setback for the EU's ambitions to expand local chip production [4][6]. Group 1: Project Background - The project was announced in July 2023 and was seen as a significant step for the EU's semiconductor industry, with Spain's government planning to allocate €12 billion from the EU's COVID-19 recovery fund to support the semiconductor sector, including Broadcom's initiative [6]. - The factory was intended to be the first backend facility on the European continent, focusing on advanced packaging and testing [6]. Group 2: Negotiation Breakdown - Negotiations between Broadcom and the Spanish government stalled due to three main issues: 1. The timing of subsidy disbursement, with Broadcom seeking upfront capital expenditure subsidies while the Spanish government preferred milestone-based payments [8]. 2. Environmental assessments and land use permits, which faced additional restrictions from local authorities, potentially extending the approval process to 18 months [9]. 3. Political factors, including upcoming elections in Spain and changes in U.S. Department of Commerce personnel, which complicated the agreement [10][11]. Group 3: Strategic Adjustments - Following the project cancellation, Broadcom is accelerating expansion at its existing facilities in Malaysia and Vietnam, planning to invest an additional $500 million to $700 million by 2026 to compensate for the lost capacity from the Spain project [12][13]. - The company is also enhancing collaborations with leading semiconductor partners like TSMC and ASE in advanced packaging technologies, crucial for its AI accelerator and networking chip businesses [12][13]. - Broadcom's investment strategy is shifting towards software and solutions, moving away from capital-intensive semiconductor manufacturing, reflecting a broader strategic transformation within the company [14].