台积电营收，三分之一来自于AI

Core Insights - TSMC is expected to dominate the high-end chip manufacturing market in the U.S., posing challenges for Intel and SMIC [2][3] - TSMC's expansion plans include significant investments in the U.S. and Taiwan, with a focus on advanced manufacturing processes [4][9] Global Capacity Layout - TSMC's wafer fabrication capacity will remain primarily in Taiwan, but additional capacity in the U.S. and Europe will provide a buffer against disruptions in Taiwan [3] - TSMC plans to build 11 new fabs and 4 packaging plants in Taiwan, potentially requiring more investment than the $165 billion planned for U.S. facilities [9] U.S. Expansion Plans - TSMC has committed to investing $165 billion in six chip fabs, two advanced packaging plants, and a research center in Phoenix, Arizona [4] - The first Arizona fab is already operational, while the second fab focusing on 3nm technology is completed and expected to ramp up production [6] Advanced Process Developments - TSMC anticipates that 2nm technology will see higher initial tape-out numbers compared to 3nm and 5nm, driven by demand from smartphones and high-performance computing (HPC) applications [11] - The A16 process is set to begin mass production in the second half of 2026, offering significant improvements in transistor density and energy efficiency [11] Financial Performance - TSMC reported record revenue of $30.07 billion for Q2, a 44.4% year-over-year increase, with net profit reaching $12.8 billion [14] - The company has a substantial cash reserve of $90.36 billion, supporting its ambitious capital expenditure plans in the U.S. and Taiwan [14] AI Chip Revenue Contribution - TSMC's HPC devices generated approximately $18 billion in sales, a 66.6% increase year-over-year, indicating a shift in revenue drivers from smartphones to AI-related products [16][19] - AI chip manufacturing and packaging contributed $8.78 billion in revenue, suggesting that AI could soon account for half of TSMC's total sales [19]