2nm太抢手，台积电疯狂扩产

Core Viewpoint - TSMC's 2nm process is set to begin mass production in the second half of this year, with strong demand from major clients like Apple, AMD, and Intel, leading to significant capacity expansion plans [1][2][3] Group 1: Production Capacity Expansion - TSMC plans to increase its 2nm monthly production capacity from 40,000 wafers at the end of this year to 100,000 wafers by next year, representing a 150% increase [1] - By 2027, TSMC anticipates further increasing the capacity to between 160,000 and 180,000 wafers, with the potential to reach 200,000 wafers if demand exceeds expectations [1][2] - The majority of the new capacity will be established at TSMC's Kaohsiung F22 facility [1] Group 2: Market Position and Client Demand - The 2nm process is expected to become TSMC's largest advanced process node by 2027, surpassing the current 7nm and 5nm processes, which have monthly capacities of approximately 160,000 wafers [2][3] - TSMC's advanced process expansion is a key driver for its performance, as more advanced nodes command higher prices, benefiting both volume and pricing [2][3] - Major clients expected to adopt TSMC's 2nm technology include Apple, AMD, Intel, Qualcomm, MediaTek, and NVIDIA [2][3] Group 3: Technological Advancements - TSMC's 2nm process technology is designed to provide significant performance and power efficiency advantages, with speed increases of 10% to 15% at the same power level, or a 25% to 30% reduction in power consumption at the same speed [3] - The company plans to introduce the N2P process technology, an extension of the N2 family, which will offer even better performance and power efficiency, expected to begin mass production in the second half of 2026 [4]