事关台积电，美国财长警告

Core Viewpoint - The article highlights the challenges faced by TSMC in establishing a semiconductor manufacturing facility in Arizona, emphasizing regulatory hurdles that may limit its production capacity to only 7% of the U.S. semiconductor needs [3]. Group 1: TSMC's Arizona Facility - U.S. Treasury Secretary warned that TSMC's $40 billion facility in Arizona may only produce 7% of the U.S. semiconductor requirements due to local regulatory challenges [3]. - The construction of the facility is reportedly slowed down by regulatory obstacles, which complicate the building process [3]. - TSMC plans to have its second factory operational by 2027, with 30% of its advanced 2nm capacity expected to come from this Arizona facility [3]. Group 2: TSMC's Advanced Process Technology - TSMC is set to begin mass production of its 2nm process technology in the second half of this year, with expectations that the design tape-outs will exceed those of the 3nm and 5nm processes in the first two years [4]. - The 2nm process technology offers a 10% to 15% speed increase at the same power consumption or a 25% to 30% reduction in power consumption at the same speed, with a chip density increase of over 15% [4]. - Future plans include the introduction of the N2P process technology, which will provide better performance and power efficiency, scheduled for mass production in the second half of 2026 [4]. Group 3: Upcoming Process Developments - TSMC's roadmap includes the A16 process, which will enhance speed by 8% to 10% at the same power consumption or reduce power consumption by 15% to 20% at the same speed, with a chip density increase of 7% to 10% [5]. - The A16 process is designed for high-performance computing (HPC) products and is expected to enter mass production in the second half of 2026 [5].