GPU-CPO，国内首创

Core Viewpoint - The concept of Co-Packaged Optics (CPO) is gaining traction, driven by major players like Intel, Broadcom, Marvell, and NVIDIA, especially in the context of increasing data traffic in data centers due to AI models and the rise of "super nodes" [1][5][20]. Market Outlook - Yole predicts that the CPO market will grow from $46 million in 2024 to $8.1 billion by 2030, with a compound annual growth rate (CAGR) of 137% [1]. Industry Dynamics - The shift from copper cables to optical fibers and CPO is seen as essential to address challenges in power, density, scalability, bandwidth, and distance in data centers [1][5]. - The increasing demand for bandwidth in large-scale data centers is leading to a transition towards optical interconnects, as copper's limitations become more apparent [6][7]. Technological Advancements - CPO technology integrates optical engines with ASIC chips on a single substrate, significantly reducing signal loss and power consumption compared to traditional optical modules [18][20]. - The collaboration between Xizhi Technology and Suiruan Technology has resulted in the first domestic xPU-CPO optical co-packaged prototype system, setting a new benchmark for data center interconnects in China [3][20][23]. Competitive Landscape - Major companies like TSMC and GlobalFoundries are also entering the CPO market, alongside numerous startups, indicating a robust competitive environment [1]. - NVIDIA's recent developments in silicon photonics and CPO technology highlight the industry's focus on reducing power consumption and improving reliability [15][16]. Future Prospects - The successful implementation of CPO technology is expected to enhance the performance of data centers, allowing for more efficient scaling and reduced operational costs [9][23]. - The maturity of the domestic CPO supply chain suggests that large-scale deployment is imminent, although some companies may be cautious due to the inherent risks of new technologies [23][24].