先进封装，高速发展

Core Insights - The advanced packaging market is projected to grow from $38 billion to $79 billion by 2030, driven by diverse demands and challenges while maintaining a continuous upward trend [2] - The advanced packaging supply chain is one of the most dynamic sub-sectors of the global semiconductor supply chain, influenced by various factors including capacity constraints, yield challenges, and geopolitical regulations [5] - High-end performance packaging is expected to reach $8 billion in 2024 and exceed $28 billion by 2030, with a compound annual growth rate (CAGR) of 23% [11] Market Growth and Trends - Advanced packaging is experiencing record breakthroughs and expanding its technology portfolio, including new versions of existing technologies like Intel's EMIB and Foveros [8] - The high-end packaging market's largest segment is telecommunications and infrastructure, generating over 67% of revenue in 2024, while the mobile and consumer market is the fastest-growing segment with a CAGR of 50% [11] - The adoption of hybrid bonding technology is increasing, making it more challenging for OSAT manufacturers, as only those with wafer fab capabilities can absorb significant yield losses [14] Supply Chain Dynamics - New alliances are forming to address supply chain challenges, with key advanced packaging technologies being licensed to support transitions to new business models [5] - Major memory manufacturers like Yangtze Memory Technologies, Samsung, SK Hynix, and Micron are expected to dominate the high-end packaging market, capturing 54% of the market share by 2024 [14] - Leading OSAT companies are focusing on high-end packaging solutions based on ultra-high-definition fan-out (UHD FO) and Mold interposer technologies [15] Technological Innovations - The main technological trend in high-end performance packaging is the reduction of interconnect spacing, which is crucial for integrating more complex chips and ensuring lower power consumption [16] - 3D SoC hybrid bonding is emerging as a key technology pillar for next-generation advanced packaging, allowing for smaller interconnect spacing and increased surface area [16] - Chipsets and heterogeneous integration are driving high-end performance packaging applications, with major players like Intel and AMD adopting these technologies in their products [17]