台积电退出六英寸代工

Core Viewpoint - TSMC plans to gradually exit 6-inch wafer manufacturing by 2027, reallocating resources to advanced packaging, which reflects a strategic shift towards higher-margin businesses [2][3]. Group 1: TSMC's Strategic Shift - TSMC has verbally informed downstream clients about the closure of its last 6-inch plant by the end of 2027, transitioning production lines to advanced packaging [2]. - The decision to exit the 6-inch wafer business is based on market demand and TSMC's long-term business strategy, ensuring a smooth transition for clients [2][3]. - TSMC's stock price remained stable, unaffected by external news regarding the closure [2]. Group 2: Market Impact - The closure of TSMC's 6-inch plant is expected to trigger a shift in orders for power management ICs (PMICs) and other mature process ICs, potentially benefiting companies like World Advanced [2]. - The trend of major manufacturers moving away from 6-inch wafers is evident, as TSMC's decision follows its previous exit from the GaN market [3]. Group 3: Industry Trends - Siltronic AG plans to cease production of small-diameter wafers by July 2025, reflecting a broader industry trend towards larger, more efficient wafers [5][6]. - SUMCO has announced a restructuring plan to end production of 200mm and smaller wafers by 2026, indicating a shift in focus to larger wafer production [6][10]. - The semiconductor industry is witnessing a decline in demand for smaller diameter wafers, with a significant shift towards 300mm wafers for improved production efficiency [9][10].