TSMC(US:TSM) 半导体芯闻·2025-08-20 11:10Core Viewpoint - TSMC is advancing its 2nm process technology with plans for a second fab in Arizona, aiming for an initial monthly capacity of approximately 20,000 wafers to meet strong local demand [1][2] Group 1: TSMC's Expansion Plans - TSMC's second fab in Arizona has completed construction and will utilize 3nm technology, with mass production timelines accelerated to support customer needs [1] - The third fab in the U.S. is under construction, set to employ both 2nm and A16 process technologies, driven by robust AI-related demand [1] - The timeline for establishing a mini-line at the second fab is now projected for Q2 2027, with mass production expected by Q4 2027, significantly ahead of the initial 2028 forecast [1] Group 2: 2nm Production Capacity - TSMC's 2nm production plans in Taiwan remain unchanged, with the Hsinchu Baoshan plant expected to reach a monthly capacity of 35,000 to 40,000 wafers by year-end, and the Kaohsiung plant already in production with a capacity of up to 10,000 wafers [2] - The total monthly capacity for TSMC's 2nm family (N2/N2P/N2X/A16) is estimated to reach 100,000 wafers by the end of 2026, with continued expansion through 2027-2028 [2] - Major clients for TSMC's 2nm technology include AMD, Apple, Qualcomm, MediaTek, Marvell, Broadcom, Bitmain, and Intel, indicating strong demand from leading industry players [2] Group 3: Competitive Landscape - Industry experts note that TSMC's capacity planning is flexible and adjusts based on customer demand and market conditions, ensuring that the expansion in the U.S. will not significantly detract from Taiwan's production capacity [2] - The demand for 2nm technology is high, and competitors like Samsung, Intel, and Rapidus still lag behind TSMC in yield, capacity expansion, and production stability, leaving TSMC as the primary choice for customers [2]