台积电2nm，重大调整！

Core Viewpoint - TSMC is removing semiconductor equipment made in mainland China from its advanced chip production lines to avoid potential disruptions from upcoming U.S. restrictions [2][3] Group 1: Equipment and Production Strategy - TSMC plans to stop using Chinese equipment in its latest 2nm chip production line, which is set to begin mass production this year [2] - The decision is influenced by the potential U.S. regulations that may prohibit chip manufacturers receiving U.S. funding from using equipment from "foreign entities of concern," interpreted to include mainland China [2] - TSMC is also reviewing its chip manufacturing materials and chemicals to reduce reliance on mainland Chinese supplies while increasing local procurement in mainland China to align with local policies [3] Group 2: Future Production Capacity - TSMC's chairman and CEO, C.C. Wei, stated that the company is accelerating the construction of its semiconductor factory in Arizona, which will account for approximately 30% of its advanced chip capacity (2nm and beyond) once completed [3] - The company had initially planned to gradually replace Chinese equipment in its 3nm process but decided to fully eliminate it starting from the newly launched 2nm node due to the complexities and resource demands of changing verified suppliers [3]