SiC中介层，成为新热点

Core Viewpoint - The Taiwanese silicon carbide (SiC) industry is experiencing rapid growth due to increasing demand from Nvidia for advanced GPU performance, despite challenges in the global SiC supply chain [3][4]. Group 1: Industry Developments - Wolfspeed, a global leader in SiC, declared bankruptcy in May, while Taiwan's GlobalWafers announced plans to develop new SiC products with clients [3]. - The shift from silicon to silicon carbide for interposer layers in advanced semiconductor processes is being driven by Nvidia's new Rubin processor, which aims to enhance performance [3][4]. - The advanced chip plans are expected to handle power levels up to 1000 volts, significantly higher than Tesla's fast charging voltage of 350 volts [4]. Group 2: Technical Insights - Nvidia's NVLink technology benefits from closer GPU and memory proximity, leading to faster data transfer and improved power efficiency, making SiC an attractive material due to its superior thermal conductivity [4]. - The transition to SiC interposer layers requires advanced cutting techniques, as SiC's hardness is comparable to diamond, and poor cutting can lead to unusable surfaces [4][5]. - The production of larger single-crystal SiC wafers is a key differentiator for Taiwanese manufacturers compared to Chinese competitors, who primarily produce 6-inch and 8-inch wafers [4]. Group 3: Future Outlook - TSMC is collaborating with global manufacturers to develop SiC interposer manufacturing technology, while new laser cutting machines are being developed by companies like DISCO [5]. - Nvidia's first-generation Rubin GPU will still use silicon interposer layers until the new cutting equipment is available, with SiC expected to be integrated into advanced packaging by the end of 2025 [5].