台积电开拓新业务

Core Viewpoint - TSMC is repurposing its old 8-inch wafer fab to produce extreme ultraviolet (EUV) pellicles, aiming for lower unit costs and more predictable supply, which is crucial for large-scale integration of these films [1][2] Group 1: TSMC's Strategy - TSMC is moving the production of EUV pellicles in-house to enhance cost efficiency and supply predictability [2] - The economic viability of EUV pellicles is critical, as their price has surged to nearly $30,000, compared to $600 for traditional deep ultraviolet (DUV) pellicles, which may hinder widespread adoption by chip manufacturers [1] Group 2: Competitive Landscape - Samsung has already invested in a Korean company, FST, which produces protective films for semiconductor manufacturing, acquiring a 6.9% stake [4] - FST is developing a full-size EUV pellicle with a thickness of 30 nanometers and a light transmittance of 90%, targeting supply negotiations with Samsung [4][5] Group 3: Technical Aspects - FST's EUV pellicles utilize a carbon nanotube (CNT) film to block dust while allowing light to pass through, and they have developed a coating technology to protect against degradation [6] - The high cost of EUV masks necessitates the use of protective films to avoid contamination and potential waste [6] Group 4: Samsung's Investments - Samsung has made significant investments in various semiconductor-related companies, including S&S Tech and YIK, to strengthen its supply chain [7]