美国工作20年！英特尔资深专家加入清华大学

Core Insights - A leading semiconductor architect from Intel, Su Fei, has left the company after nearly two decades to join Tsinghua University as a full-time professor [1][3] - Su Fei has extensive experience in chip testing and semiconductor reliability, focusing on enhancing the reliability, safety, and long-term performance of advanced microprocessors used in various products [1][4] Group 1: Professional Background - Su Fei is a senior engineer and has held the position of Chief Chip Architect at Intel from 2006 to 2025, after which he joined Tsinghua University [3][4] - He has contributed to the development of global chip design standards and has received multiple industry honors for his work [3] Group 2: Research Focus - His research interests include design-for-testability, design-for-dependability, and silicon lifecycle management, addressing critical challenges in chip testability, reliability, safety, and computing resilience [4] - Su Fei's innovations have led to multiple international patents in areas such as 3D chip testing and functional safety of analog chips [4]