Core Viewpoint - The article discusses the recent high interest in NVIDIA's new liquid cooling solution, specifically the microchannel lid, and its implications for the semiconductor industry [2][4]. Group 1: Investment Bank Perspectives - JP Morgan and Morgan Stanley provided detailed analyses of the microchannel lid, highlighting its efficiency in heat dissipation compared to traditional cooling methods [5]. - The microchannel lid integrates a heat spreader and cold plate, allowing for efficient heat transfer and cooling, which is crucial as chip power requirements increase [8][11]. - The adoption of the microchannel lid could increase the number of quick disconnects (QD) in VR series compute trays to at least 12, compared to 8 in the existing GB300 compute trays [12]. - In the short term, the impact on liquid cooling suppliers is limited, as a significant portion of NVIDIA's GPU shipments will still use traditional cold plates [13]. - Currently, ODMs are in the testing phase for the microchannel lid, with a decision expected in one to two months [14]. Group 2: Industry Perspectives - The microchannel lid concept was discussed in the industry as early as late August, with market speculation about its potential use in NVIDIA's Rubin GPU [15]. - Jentech, a key supplier for NVIDIA's lid products, is closely tied to NVIDIA's technology iterations and order fluctuations, which can influence its stock performance [16]. - The maturity of different cooling technologies ranks single-phase cold plates as significantly ahead, followed by dual-phase cold plates and immersion cooling, with microchannel lids lagging behind [18]. - Cold plate suppliers like AVC indicated that the microchannel lid may not be adopted until the release of the Rubin Ultra model, as current production timelines do not support its implementation [18]. - Companies are currently sending samples for the microchannel lid, but sample approval does not guarantee immediate procurement [19]. - Key players in the lid and cold plate sectors, such as Jentech and AVC, are conducting advanced research on microchannel lids, but it remains uncertain which company will dominate the market [21]. - Besides microchannel lids, 3D printing is also emerging as a cutting-edge research direction in the cooling field, offering high precision and customization capabilities [21].
英伟达Rubin的液冷新方案?