ST斥巨资，发力面板级封装

Group 1 - The core viewpoint of the article is that STMicroelectronics is investing over $60 million to develop next-generation panel-level packaging technology at its facility in Tours, France, with operations expected to start in Q3 2026 [2] - This investment is part of a broader plan to reshape the company's manufacturing footprint, focusing on advanced manufacturing infrastructure in France and Italy [2] - The company has been developing panel-level packaging using direct copper interconnect (PLP-DCI) since 2020, which improves electrical performance, heat dissipation, and miniaturization while reducing power loss [2] Group 2 - The current automated PLP-DCI production line in Malaysia produces over 5 million large panels (700x700 mm) daily [2] - The project is expected to benefit from synergies with the local research ecosystem, including the CERTEM R&D center [2] - Panel-level packaging is an advanced chip packaging and testing technology that enhances efficiency, reduces costs, and enables smaller, more powerful, and cost-effective devices [2]