Core Insights - The article discusses the competitive landscape in the HBM4 market, particularly focusing on NVIDIA's efforts to enhance specifications and supply chain dynamics as it prepares for the launch of the MI450 Helios platform in 2026 [2][3]. Group 1: HBM4 Specifications and Supply Chain - NVIDIA is pushing suppliers of key components for the Vera Rubin server rack to increase product specifications, specifically targeting a Speed per Pin of 10Gbps for HBM4 [2]. - HBM4 is identified as a critical component for AI servers, with transmission speed and bandwidth being key areas for improvement [2]. - Samsung plans to upgrade its HBM4 base die process node to FinFET 4nm by the end of 2024, aiming for a transmission speed of 10Gbps, which is expected to surpass competitors SK hynix and Micron in production output [2]. Group 2: Supplier Dynamics and Market Forecast - NVIDIA's strategy includes evaluating supply capacity; if supply is insufficient or if new specifications lead to excessive energy consumption or costs, NVIDIA may reconsider upgrades or categorize products based on different supplier levels [3]. - TrendForce forecasts that SK hynix will remain the largest supplier of HBM4 in 2026, with Samsung and Micron's market share dependent on the performance of their subsequent product samples [3].
研报 | 英伟达尝试调升HBM4规格,预期2026年SK海力士仍是最大供应商