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每周观察 | 3Q25全球智能手机面板出货量季增8.1%;存储器产业2026年资本支出预估…
TrendForce集邦· 2025-11-14 04:07
新机带动需求回温,2025年第三季度全球智能手机面板出货量季增8.1% 根据Tr endFor c e集邦咨询最新调查, 2025年第三季全球智能手机面板出货量达5.86亿片,季增 8.1%、年增5.3% 。主要成长动能来自iPhone 17系列与其他主要手机品牌下半年新品拉货,除 此之外,第三季AMOLED面板需求持续增温,以及LCD面板在入门手机与维修市场维持稳定出 货。 预估2025年全年手机面板出货量将达22.43亿片,年增3.4%,为近年高峰 。 点击右边 阅读原文 了解更多详情 根据Tr endFor c e集邦咨询调查显示,随着存储器平均销售价格(ASP)持续提升,供应商获利也 有所增加,DRAM与NAND Fl a sh后续的资本支出将会持续上涨,但对于2026年的位元产出成 长的助力有限。DRAM和NAND Fl a sh产业的投资重心正逐渐转变,从单纯地扩充产能,转向 制程技术升级、高层数堆栈、混合键合以及HBM等高附加价值产品。 点击右边 阅读原文 了解更多详情 #存储器 #手机面板 #DRAM #NANDFlash TrendForce 半导体产业 趋势分析 商业洞察 信息精选 PS: ...
光伏周价格 | 供需失衡持续演变,光伏产业链各环节均面临挑战
TrendForce集邦· 2025-11-13 05:48
01 周价格表 01 多晶硅: 库存高企致价格暗降,短期或转入"弱稳"阶段 库存 当前硅料库存量已达到43万吨左右,并且仍处于持续累库阶段 。 供给 行业整体产出已有所降低,预计11月份产量约为12.5万吨,环比减少1.1万吨。主流企业的开工情况 增减不一:红狮、新特、弘元等维持满产或高开工;而通威、协鑫等头部企业的部分基地则正在降开 工率或计划下调;同时,部分项目(如戈恩斯、南玻)处于检修或低开工率状态,亦有项目(如青海 丽豪、东方希望)检修后爬坡或试生产 。 需求 | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | --- | --- | --- | --- | --- | | N型复投料(RMB) | 55.000 | 47.000 | 50.000 | 0.00% | | N型致密料(RMB) | 53.000 | 45.000 | 48.000 | 0.00% | | N型颗粒硅(RMB) | 49.000 | 45.000 | 47.000 | 0.00% | | 非中国区多昌娃(USD) | 22.000 | 13.100 | 17.500 | 0.00% | | 硅 ...
研报 | 存储器产业2026年资本支出仍显保守,对位元产出成长助力有限
TrendForce集邦· 2025-11-13 05:48
Core Insights - The article discusses the increasing average selling prices (ASP) of memory products, leading to higher profits for suppliers, and a shift in capital expenditure focus towards technology upgrades and high-value products in the DRAM and NAND Flash industries [2][4]. DRAM Industry - Capital expenditure for the DRAM industry is projected to reach $53.7 billion in 2025 and grow to $61.3 billion in 2026, representing a 14% year-over-year increase [4]. - Micron is identified as the most aggressive player, with a projected capital expenditure of $13.5 billion in 2026, a 23% increase, focusing on 1 gamma process penetration and TSV equipment [5]. - SK Hynix is expected to invest $20.5 billion in 2026, a 17% increase, to expand HBM4 capacity [5]. - Samsung plans to invest $20 billion, an 11% increase, for HBM 1C process penetration and slight increases in P4L wafer capacity [5]. - There is a limited capacity expansion opportunity for Micron until its new facility in the U.S. is completed, expected to contribute to output only by 2027 [5]. NAND Flash Industry - Kioxia/SanDisk is noted as the most proactive in expanding capacity, with a projected investment of $4.5 billion in 2026, a 41% increase, to accelerate BiCS8 production and invest in BiCS9 R&D [6]. - Micron aims for a slight increase in NAND Flash capacity with a projected capital expenditure increase of 63% in 2026, focusing on G9 processes and Enterprise SSDs [6]. - Samsung and SK Hynix/Solidigm are expected to reduce or limit NAND Flash capital expenditures, prioritizing investments in HBM and DRAM [6]. - The demand surge in the NAND Flash market is driven by the rapid increase in storage capacity needs due to AI and a shortage of HDDs, leading to a structural shortage rather than a temporary market fluctuation [6][7]. Market Outlook - The article indicates that the capital expenditure focus in 2026 will shift towards process upgrades and hybrid-bonding rather than capacity expansion, resulting in limited output growth [7]. - The NAND Flash market is expected to continue experiencing supply shortages throughout 2026 [7].
HBM、晶圆代工、机器人...谁将是2026年科技产业的“黑马”?TrendForce即将发布十大趋势预测
TrendForce集邦· 2025-11-11 04:02
AI人工智能浪潮正以前所未有的速度持续席卷全球,科技产业的未来图景已不再是简单的迭代,或 将是一场惊心动魄的"剧本重写"。 AI运算从训练到推理的数据量与存储器带宽需求呈爆炸性成长,导致传输速度与能耗瓶颈浮上台 面。未来将如何解决AI运算对存储器带宽与数据传输速率的限制?次世代AI架构的核心突破口是什 么? 晶圆代工领域,随着2nm进入量产,在先进制程商业竞逐中,将不再是单一技术的较量,而是多维 度的系统性挑战。当TSMC、Intel、Samsung等巨头,以各自的尖端封装方案(如CoWoS, EMIB, I- Cube)竞逐未来制高点时,真正的决胜因素,远比你想象的更复杂。 人形机器人从实验室走向产业化,预计2026年出货量将呈爆发式增长,成为智能制造与服务场景 的"新物种"。它将会是下一个颠覆全球劳动力市场的"iPhone时刻"吗? 当然,全球科技产业未来变革不止于此,在AI等技术的赋能下,不仅重塑了现有的产业格局,更催 生全新的可能性。悬念与机遇并存,挑战与突破同在,更多前沿领域正蓄势待发。 为全面洞察2026年科技产业发展趋势, TrendForce集邦咨询将于2025年11月27日在深圳 鹏瑞莱佛 ...
研报 | 新机带动需求回温,2025年第三季度全球智能手机面板出货量季增8.1%
TrendForce集邦· 2025-11-10 07:09
Nov. 10, 2025 产业洞察 分析主要面板厂第三季出货表现, BOE (京东方)以逾1.45亿片的出货量稳居全球第一,季增 1.3%;CSOT a-Si LCD ( 华 星 光 电 ) 供 货 增 幅 明 显 , 带 动 整 体 出 货 季 增 13.5% , 达 7,550 万 片 ; Tianma(天马)同样因a-Si LCD出货增加,整体出货量季增25.1%,为5,630万片。韩系面板厂得益 于 iPhone 新 机 发 布 , SDC ( 三 星 显 示 ) 出 货 量 成 长 至 1 亿 片 以 上 , 季 增 8.3%;LGD 出 货 也 季 增 16.7%,达2,100万片,其全年供应iPhone面板量可望破8,000万片。台系Innolux(群创光电)虽已减 少手机应用出货,第三季出货量仍有2,320万片。 TrendForce集邦咨询表示, 第三季AMOLED手机面板出货达2.46亿片,季增9.9% 。随着AMOLED 面板获中阶机型扩大采用,有助整体渗透率提升。SDC以40%的出货占比持续主导中高阶市场;BOE 则稳定供应iPhone与其他主要手机品牌;Visionox(维信诺)凭 ...
MTS议题公布|价格疯涨?供需博弈?大咖共探2026年存储产业趋势
TrendForce集邦· 2025-11-10 07:09
存储风云·智塑未来 2025年11月27日 TrendForce集邦咨询将在 深圳鹏瑞莱佛士酒店举办 MTS2026存储产业趋势研讨会 本次研讨会聚焦AI技术驱动下的 存储产业变革与全球生态重构 演讲嘉宾及议程已更新 敬请期待 MTS2026 议程 会议时间 日期 and and the 地点 2025/11/27(周四) 9:00-17:30 > 深圳鹏瑞莱佛士酒店 (2F大宴会厅) . . . . 讲者介绍 开场致辞 集邦咨询 董事长 董昀昶 解析AI狂潮与供需变量下的晶圆代工 双面格局 集邦咨询 资深研究副总经理 郭祚荣 产能博弈,价格狂飙? 2026年内存发 展趋势分析 集邦咨询 资深研究副总经理 吴雅婷 从核心到边缘,存储创新助力AI突破 Solidigm 亚太区销售副总裁 倪锦峰 体验革命: AI头戴装置的未來之路 集邦咨询 资深研究副总经理 邱宇彬 芯储未来: Al存储的价值重构与生态 其顾 存算协同创新,推动AI应用普惠 钱兴科技 董事长 黄少娃 至强6 赋能云智时代的存算引擎 英特尔 数据中心与人工智能集团副总裁 兼中国区总经理 陈葆立 "业高质量发展的"隐形推手" 时创意 董事长 倪黄忠 ...
每周观察 | 3Q25全球电视出货约4975万台;预计2026年CSP合计资本支出年增40%;全球固态电池需求量预测…
TrendForce集邦· 2025-11-07 04:08
2025年第三季度全球电视出货量首度跌破5,000万台,季增6% 根据Tr endFor c e集邦咨询最新调查, 2025年第三季全球电视出货量仅约4,975万台,季增6%、 年减 4.9%,为历年同期首度跌破5,000万台 。主因在于消费者购买周期延长、国际形势变化造 成的需求提前效应,以及中国市场补贴政策效益逐渐消退,导致整体市场规模萎缩。 随着北美云端服务大厂(CSP)近日公布最新财报指引,Tr endFor c e集邦咨询将2025年全球八大 主要CSPs资本支出(CapEx)总额年增率从原本的61%,上修至65%。 预期2026年CSPs仍将维 持积极的投资节奏,合计资本支出将进一步推升至6,000亿美元以上,年增来到40% ,展现出 AI基础建设的长期成长潜能。 点击右边 阅读原文 了解更多详情 预计2035年全球固态电池需求量将达到740GWh 固态电池发展正从实验室走向产业化,根据Tr endFor c e集邦咨询最新研究,全球已有近百家企 业规划固态电池产能,合计达到上百GWh。其中,含半固态电池在内的部分产能已率先量产, 目前扩大至GWh级。全固态电池则进入百MWh级小规模试产的验证和制 ...
光伏周价格 | 硅料价格弱势维稳,硅片、电池承压下行
TrendForce集邦· 2025-11-06 06:36
01 周价格表 | | | | | 更新日期: 2025/11/5 | | --- | --- | --- | --- | --- | | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | N型复投料(RMB) | 55.000 | 47.000 | 50.000 | 0.00% | | N型致密料(RMB) | 53.000 | 45.000 | 48.000 | 0.00% | | N型颗粒硅(RMB) | 49.000 | 45.000 | 47.000 | 0.00% | | 非中国区多晶硅(USD) | 22.000 | 13.100 | 17.500 | 0.00% | | 硅片 | 高点 | 低点 | 均价 | 涨跌幅 | | N型183单晶硅片-183mm/130µm (RMB) | 1.320 | 1.300 | 1.300 | -1.52% | | N型210单晶硅片-210mm/130μm (RMB) | 1.680 | 1.650 | 1.650 | -1.79% | | N型210R单晶硅片-210*182mm/130μm (RMB) | 1.330 | 1 ...
研报 | 预计2026年CSP合计资本支出增至6,000亿美元以上,AI硬件生态链迎新成长周期
TrendForce集邦· 2025-11-06 06:36
Core Insights - The article highlights the upward revision of capital expenditure (CapEx) growth for major North American Cloud Service Providers (CSPs) from 61% to 65% for 2025, with expectations of further growth to over $600 billion in 2026, reflecting the long-term growth potential of AI infrastructure [2][4]. Group 1: Capital Expenditure Trends - The eight major CSPs include Google, AWS, Meta, Microsoft, Oracle, Tencent, Alibaba, and Baidu. Google has raised its 2025 CapEx forecast to $91-93 billion to meet the increasing demand for AI data centers and cloud computing [4]. - Meta has also increased its 2025 CapEx to $70-72 billion, indicating significant growth in 2026 [4]. - Amazon has adjusted its 2025 CapEx estimate to $125 billion, while Microsoft expects its 2026 CapEx to exceed that of 2025 [5]. Group 2: Impact on AI Hardware Ecosystem - The surge in CapEx is expected to stimulate demand for AI servers, driving growth in upstream supply chains such as GPU/ASIC, memory, packaging materials, and downstream systems like liquid cooling modules and power supplies [5][6]. - NVIDIA is anticipated to benefit significantly from this CapEx growth, with expected shipments of its GB300 and VR200 products surpassing previous forecasts, primarily driven by the top five North American CSPs [5]. - Oracle is expected to see substantial growth due to demand from North American government projects and cloud AI database leasing services [5]. Group 3: Future Developments in AI Solutions - The market is expected to adopt integrated AI solutions more aggressively in 2026, with NVIDIA planning to launch a new generation of VR200 racks [6]. - Competitor AMD is also set to promote its Helios integrated solutions, with Meta and Oracle being among the first adopters [6]. - Meta plans to significantly increase its CapEx by 65% to $118 billion in 2026 to support its initiatives in NVIDIA's GB/VR Rack and self-developed ASIC solutions [6].
面板价格观察 |11月电视面板价格预测将全面下调,笔电面板价格谨慎微调
TrendForce集邦· 2025-11-06 06:36
Core Viewpoint - TrendForce predicts a comprehensive decline in TV panel prices for November 2025, while monitor panel prices are expected to remain stable compared to the previous month, with slight decreases anticipated for some laptop panels [4][5][6]. TV Panel Prices - TV panel demand has slightly weakened, but some brands are still willing to place orders. Panel manufacturers are making minor adjustments to production rates while accommodating brand demands. As the year-end approaches, most brand clients and panel manufacturers are beginning to observe panel prices [4]. - The forecast for November indicates a decrease of $1 for 32-inch and 43-inch panels, $2 for 50-inch and 55-inch panels, and $3 for 65-inch and 75-inch panels [5]. Monitor Panel Prices - Demand for monitor panels has significantly weakened entering the fourth quarter, but manufacturers are cautious in adjusting prices, leading to continued losses. Consequently, a consensus has been reached between buyers and sellers to maintain stable prices for monitor panels [6]. - The only expected price drop is for the 23.8-inch VA Open Cell panel, which may decrease by $0.1, while other mainstream sizes are anticipated to remain stable [6]. Laptop Panel Prices - Despite entering the traditional off-season, demand for laptop panels is slightly stronger than expected, with some brand clients willing to increase their purchase volumes. Panel manufacturers are adopting a more flexible pricing strategy to maintain customer relationships, leading to minor price concessions [7]. - The forecast for November suggests that TN panel prices will remain stable, while IPS panel prices are expected to decrease by $0.1 across the board [7].