ST(US:STM) 势银芯链·2025-09-19 07:27Core Viewpoint - The article discusses the advancements in packaging technology, particularly focusing on Panel Level Packaging (PLP) and its significance in the semiconductor industry, highlighting the need for more efficient and cost-effective solutions as device sizes shrink and complexity increases [2][3][4]. Group 1: Packaging Technology Developments - Wafer Level Packaging (WLP) and flip chip technology have been mainstream methods in the past decade, but their scalability and cost-effectiveness are reaching limits, necessitating the development of more advanced technologies [2]. - PLP is identified as a key technology that enhances production efficiency and reduces costs, enabling the creation of smaller, more powerful, and cost-effective electronic devices [2]. - PLP-DCI allows multiple ICs to be packaged on a single larger rectangular substrate, improving yield and reducing costs while enabling the integration of multiple chips within a system-in-package (SiP) [3]. Group 2: Company Initiatives and Investments - STMicroelectronics announced plans to develop next-generation PLP technology at its facility in Tours, France, with operations expected to commence in Q3 2026, supported by over $60 million in capital investment [3][4]. - The development of the new PLP pilot production line aims to enhance efficiency and flexibility for various applications, including RF, analog, power, and microcontrollers [4]. - STMicroelectronics has achieved a market share of 3% in PLP in 2023, projected to rise to 31% in 2024 with support from strategic clients like Tesla, marking a nearly 18-fold increase in PLP revenue [4]. Group 3: Upcoming Events and Industry Collaboration - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on advanced packaging technologies and fostering collaboration in the Ningbo and Yangtze River Delta regions [5]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP, inviting experts from industry and academia for in-depth discussions [5].