三星，跌至第三

Core Insights - Samsung Electronics is expected to surpass a 30% market share in the High Bandwidth Memory (HBM) market next year, despite underperforming in the first half of this year compared to SK Hynix and Micron Technology [1][2] - Counterpoint Research reported that in Q2, SK Hynix held a 62% market share, Micron 21%, and Samsung 17%, indicating that 80% of global HBM products come from South Korean companies [1] - The anticipated growth for Samsung is attributed to the upcoming certification of its HBM3E products and the expansion of its market share through HBM4 exports [1] Group 1 - Samsung has launched HBM4 based on 10nm-class sixth-generation (1c) DRAM technology, which combines with 4nm foundry technology [2] - The HBM4 development was completed in July, with sample shipments to major clients, and mass production is expected to be established by the end of the year [2] - HBM4 offers a 40% improvement in power efficiency and a data processing speed of up to 11Gbps compared to the previous generation [2] Group 2 - The dominance of South Korean companies in the HBM market is expected to strengthen with the launch of HBM4 [2] - SK Hynix, the current market leader, has completed HBM4 development and established a mass production system, pending quality testing for application in NVIDIA's next-generation AI GPU Rubin [2] - Chinese companies are attempting to catch up in the HBM market, but face challenges due to high technical difficulties and have not yet achieved mature mass production [2]