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中金 | AI“探电”(十二):Rubin或推动微通道液冷技术应用,液冷通胀逻辑再强化
NvidiaNvidia(US:NVDA) 中金点睛·2025-09-24 23:56

Core Viewpoint - The article discusses the potential of microchannel liquid cooling technology in response to increasing power demands from next-generation chips like Nvidia's Rubin, which may exceed 2000W, necessitating a shift from traditional cooling methods to more efficient solutions like microchannel water cooling plates [2][6][27]. Group 1: Microchannel Liquid Cooling Technology - Microchannel cooling plates are expected to enhance cooling efficiency significantly compared to traditional cooling solutions, offering advantages such as lower thermal resistance, larger heat exchange area, and higher flow rates [14][16]. - The manufacturing of microchannel cooling plates presents higher barriers due to the need for advanced production techniques like etching and 3D printing, which increases costs and requires improved system cleanliness and pump capabilities [16][27]. - The transition to microchannel cooling technology may reshape the liquid cooling supply chain, providing opportunities for domestic manufacturers to enter the market [17][24]. Group 2: Market Dynamics and Opportunities - The current market for microchannel liquid cooling involves three main types of companies: startups specializing in microchannel technology, traditional cooling solution manufacturers, and companies focused on cover plates [18][23]. - Startups like Mikros Technologies and JetCool are collaborating with major electronic manufacturing services to enhance their technology's market adoption, showcasing the potential for high thermal management performance [18][23]. - The shift to microchannel technology may create opportunities for domestic suppliers, particularly those with existing capabilities in related manufacturing processes, to meet the evolving demands of the cooling solutions market [24][25].