1.8nm，英特尔新一代处理器晶圆公开

Core Insights - Intel has announced the architecture details of its new client processor, Intel® Core™ Ultra (3rd generation), which is expected to achieve mass production within this year, with the first SKU shipping by the end of the year and large-scale market supply starting in January 2026 [2][4] - The Intel® Core™ Ultra processor is the first client system-on-chip (SoC) built on the Intel 18A process technology, aimed at providing computational power for consumer and commercial AI PCs, gaming devices, and edge computing solutions [4][5] - Intel's 18A process technology is the company's first 2nm process node, which integrates key innovations such as Gate-All-Around (GAA) transistors and Backside Power Delivery Network (BSPDN), promising a 15% frequency increase, 1.3 times transistor density, and a 25% reduction in power consumption compared to the previous Intel 3 process [7][8] Industry Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and aiming to enhance the electronic information industry in the Yangtze River Delta region [9] - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging techniques like TGV and FOPLP, inviting experts from industry and academia for in-depth discussions [9] Product Performance - The new Intel processors are designed to achieve performance levels comparable to Lunar Lake in energy efficiency and Arrow Lake in performance, with up to 16 new performance cores and efficiency cores, resulting in over a 50% performance improvement compared to the previous generation [10] - The new Intel graphics architecture, Intel Iris™ GPU, can feature up to 12 Xe cores, also delivering over a 50% improvement in graphics performance compared to the previous generation [10]