台积电资本支出，创历史新高

Group 1 - TSMC will hold a conference on October 16, with strong demand for its 2nm capacity, leading major clients like Apple, AMD, Qualcomm, and MediaTek to fully book the capacity for next year [2][3] - TSMC's 2nm production facilities in Hsinchu and Kaohsiung are in trial production, with a yield rate nearing 70%, expected to enter mass production by the end of the year [2] - The estimated monthly production capacity for TSMC's 2nm process could reach 40,000 wafers by the end of the year, potentially increasing to nearly 100,000 wafers by the end of next year [2][3] Group 2 - TSMC's advanced packaging capacity is also expected to rise, with overall monthly capacity projected to exceed 150,000 wafers next year due to increased demand from major clients [3] - Capital expenditures for TSMC are anticipated to exceed this year's $38 billion to $42 billion, reaching new historical highs by 2026 [3] Group 3 - The global spending on 300mm wafer fab equipment is projected to reach $374 billion from 2026 to 2028, with a significant increase in investment driven by AI chip demand and regional supply chain localization [5] - In 2025, global spending on 300mm wafer fab equipment is expected to surpass $100 billion for the first time, with a growth rate of 7% [5] Group 4 - The memory sector is projected to invest $136 billion over three years, marking the beginning of a new growth cycle, with DRAM and 3D NAND investments expected to exceed $79 billion and $56 billion, respectively [6][7] - The demand for high-bandwidth memory (HBM) is expected to rise significantly due to AI training and inference needs [7] Group 5 - China is expected to lead global 300mm equipment spending with an investment of $94 billion from 2026 to 2028, followed by South Korea at $86 billion and Taiwan at $75 billion [8]