Workflow
【盛美上海(688082.SH)】公司完成定增,25年前三季度在手订单持续高增——跟踪报告之五(刘凯/于文龙)

Core Viewpoint - The company has demonstrated strong growth in its order backlog and is actively expanding its market presence in the semiconductor equipment industry, driven by technological advancements and product development [4][5]. Group 1: Order Backlog and Growth - As of September 29, 2025, the company's order backlog reached 9.072 billion yuan, representing a year-on-year increase of 34.10% [4]. - The semiconductor equipment demand in China has remained robust in 2025, allowing the company to deepen its existing market and explore new opportunities [4]. Group 2: Fundraising and Investment - The company announced a plan to issue A-shares to specific investors, aiming to raise 4.482 billion yuan through the issuance of 38.6013 million shares at a price of 116.11 yuan per share [4]. - The raised funds will primarily be allocated to three projects: the construction of R&D and process testing platforms, iterative R&D of high-end semiconductor equipment, and supplementing working capital [6]. Group 3: Product Development and Innovation - The company has placed significant emphasis on product R&D, with new products contributing to sustained order growth [5]. - In March 2025, the company successfully validated its self-developed single-wafer high-temperature SPM equipment with key customers, which is crucial for the manufacturing of next-generation semiconductor devices [5]. - The delivery of the 1500th electroplating chamber for ECP equipment in the first half of 2025 has achieved full coverage of electroplating technology across various applications [5].