TSMC(US:TSM) Counterpoint Research·2025-10-23 09:03Core Insights - The article highlights the ongoing profitability of the wafer foundry 2.0 era, with TSMC solidifying its leadership position, achieving revenue of approximately $33.1 billion in Q3 2025, exceeding previous guidance [4][8]. Group 1: TSMC Performance - TSMC's Q3 2025 revenue reached around $33.1 billion, driven by strong demand for 3nm and 4/5nm nodes, particularly from AI GPU and high-performance computing clients [8]. - The utilization rate for TSMC's advanced nodes remains extremely tight, with 3nm capacity primarily driven by Apple and sustained demand for 4/5nm chips from NVIDIA, AMD, and other large clients [8]. - TSMC is increasing capacity allocation for high-value N3 and N5 nodes to alleviate long-term supply constraints [8]. Group 2: Market Trends - The utilization rate for 6/7nm nodes has slightly declined, while 12/16nm and 22/28nm nodes have also shown a downturn after a temporary rebound due to Wi-Fi 7 chip migration [9]. - The capacity utilization rate for mature process foundries outside mainland China is expected to drop from over 80% to 75%-80%, reflecting the fading effects of pre-ordering amid tariff uncertainties and seasonal factors [9]. Group 3: Intel and Samsung Developments - Intel's 18A process is crucial for its success, with the company shifting its strategy to a customer commitment-driven model to ensure capacity expansion aligns with actual demand [10][11]. - Samsung's advanced process utilization and wafer shipments increased in Q2 2025, driven by smartphone chip shipments, with future prospects hinging on the market performance of its 2nm chips [12]. Group 4: Advanced Packaging and OSAT - The demand for advanced packaging is rapidly expanding, reshaping the global wafer foundry landscape, with TSMC at the core of this transformation [12][13]. - ASE, a major OSAT player, reported a 9% year-over-year revenue increase in September, with Q3 revenue estimated at around $5 billion, benefiting from TSMC's CoWoS demand [13]. - Advanced packaging innovations are becoming a key competitive differentiator in the wafer foundry 2.0 era, enhancing the strategic value of foundries and OSATs in system-level performance optimization [13][15].