台积电将退出成熟制程

Core Viewpoint - TSMC is shifting its focus towards advanced processes and packaging, gradually outsourcing lower-margin 40-90nm orders to its subsidiary, World Advanced, while aiming to maintain a long-term gross margin target of 53% [2][3]. Group 1: Strategic Shifts - TSMC is phasing out low-margin process nodes and reallocating resources to high-value processes, particularly in response to strong AI demand, focusing on 3nm and more advanced nodes [3][6]. - The company is expected to see a gross margin dilution of approximately 2-3 percentage points annually due to the ramp-up of overseas wafer fabs, potentially increasing to 3-4 percentage points in the coming years [3][4]. - TSMC's revenue share from advanced processes (7nm and below) is projected to rise from 65% in Q1 2024 to 74% by Q4 2025, indicating a clear trend towards higher-margin business [3][4]. Group 2: Operational Adjustments - TSMC is closing its 6-inch wafer fab in Hsinchu and plans to exit GaN foundry services within two years, selling some equipment to World Advanced [2][5]. - The company is encouraging clients to transfer some mature process orders to World Advanced, which will help mitigate the impact on customers while meeting the demand for non-China, non-Taiwan production [5][6]. Group 3: Pricing Strategies - TSMC is set to increase prices for chips produced using processes below 5nm starting January 2026, with an expected average price increase of 3-4%, and potentially up to 10% for the most advanced nodes [6][7]. - The price hikes are driven by rising manufacturing costs and sustained demand for cutting-edge chips, particularly in AI and high-performance computing sectors [6][7]. Group 4: Market Implications - The shift towards advanced nodes may create bottlenecks for mature 6nm and 7nm processes, affecting clients who do not require the latest technology [7]. - Major chip manufacturers like Nvidia and Qualcomm may pass on increased costs to consumers, leading to higher prices for consumer products [7].