美光DRAM厂，延期五年

Core Viewpoint - Micron Technology has announced significant delays in the construction of its wafer fabrication plant in Clay, New York, now expected to begin production by the end of 2033, impacting the semiconductor production cluster in the region that was initially set to start in 2025 [2][6][7] Summary by Sections Project Delays - The construction timeline for the first wafer fab (Fab 1) has been extended, with the start of construction now pushed to late 2026, leading to a projected start of DRAM production around 2030, five years later than originally planned [2][3][6] - The construction start dates for subsequent fabs (Fab 2, Fab 3, and Fab 4) have also been delayed, with full completion of the Micron campus now expected by 2045, five years later than the initial schedule [3][6] Strategic Adjustments - Micron is accelerating the construction of its Idaho wafer fabrication plant and reallocating funds from the CHIPS Act to this facility, indicating a strategic shift in project priorities [2][7] - The revised timeline for the New York project has been attributed to the early initiation of the Idaho facility, which is set to be completed before the Clay site [7] Environmental Impact Reports - The environmental impact report indicates that the construction period for Fab 1 will extend from three years to approximately four years, affecting the overall project timeline, including hiring and operational plans [6][7]