苹果首颗2nm芯片，重大突破！

Core Insights - The article discusses Apple's upcoming A and A Pro chipsets, which will be the first to utilize TSMC's nm process technology, promising significant performance and efficiency improvements [1][2]. Chip Packaging Transition - The transition from InFO (Integrated Fan-Out) to WMCM (Wafer-Level Multi-Chip Module) packaging technology is highlighted as a major difference for A and A Pro, allowing multiple independent dies to be integrated into a single package [2]. - This change offers several advantages, including enhanced design flexibility, improved scalability for product variations, and better energy efficiency through tighter integration of components [2]. Manufacturing Process Improvements - The adoption of Molded Underfill (MUF) technology in WMCM is expected to simplify the manufacturing process, reduce material consumption, and improve yield rates, thereby offsetting increased costs associated with TSMC's nm technology [3]. Cache Capacity Enhancements - The article notes significant improvements in cache capacity for A and A Pro, with the flagship chip's system-level cache (SLC) increasing from MB to MB, and the performance core L cache bandwidth for A Pro rising from GB/s to GB/s [5]. - Predictions for next year's cache capacities include A with a total of MB and A Pro with a range of MB to MB [5]. Energy Efficiency Innovations - Apple's advancements in energy efficiency cores are emphasized, with A Pro's energy core frequency showing a modest increase, yet achieving substantial performance gains in integer and floating-point benchmarks without increasing power consumption [6]. GPU Dynamic Cache Technology - The introduction of third-generation dynamic cache technology in A Pro allows for real-time memory allocation based on workload demands, enhancing performance and efficiency [8]. - This technology aims to reduce memory waste and improve GPU utilization, with expectations for further optimization in memory allocation granularity and speed [8]. iPhone 18 Series Integration - The A and A Pro chipsets are set to debut in the iPhone 18 series, with A Pro expected to be featured in iPhone 18 Pro, iPhone 18 Pro Max, and iPhone Fold, while the A chipset will be used in the iPhone 20 series in 2027 [9].