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Core Viewpoint - The rapid proliferation of AI applications is driving demand for advanced packaging technologies in the semiconductor industry, with TSMC's CoWoS becoming a well-known solution. The company is also developing next-generation packaging technologies like CoPoS and CoWoP to enhance area utilization and cooling efficiency [1][10]. Group 1: Advanced Packaging Technologies - CoWoS (Chip-on-Wafer-on-Substrate) integrates multiple chips on a substrate to reduce space and improve performance, particularly for AI chips requiring high bandwidth and low latency [2][6]. - TSMC's CoWoS-L variant has seen a significant increase in demand, accounting for approximately 60% of CoWoS sales, due to its lower cost and ability to integrate passive components [6][9]. - The next-generation packaging technologies, CoPoS and CoWoP, aim to reduce costs and improve efficiency, with CoPoS utilizing a rectangular panel to enhance area utilization [10][11]. Group 2: Market Growth and Projections - The Taiwanese semiconductor packaging industry is projected to reach NT$710.4 billion by 2025, with a CAGR of 13.9%, and further growth to NT$759 billion by 2026, driven by AI and HPC infrastructure demands [1][2]. - TSMC's advanced packaging capacity is expected to grow significantly, with CoWoS capacity increasing by over 80% and SoIC capacity by more than 100% from 2022 to 2026 [2][9]. Group 3: Industry Challenges and Developments - The semiconductor industry faces challenges in meeting the increasing demand for advanced packaging, necessitating collaboration and innovation among manufacturers [10]. - TSMC is expanding its advanced packaging facilities in the U.S. and Taiwan, with plans to start testing CoPoS by 2026 and mass production by 2028 [8][9]. - The shift towards advanced packaging is shortening the time from design to mass production, reducing the development cycle from approximately 1.5 years to less than a year [9][10].