HBM4,巨头大幅扩产

Group 1 - SK Hynix has adjusted the timeline for the mass production of its HBM4 (High Bandwidth Memory) to March or April next year, delaying the initial plan by about one to two months [3][4] - The HBM4 memory will be used in NVIDIA's next-generation AI accelerator, Rubin, which is expected to be released next year, featuring double the I/O channels compared to the previous generation [3] - The company plans to maintain the highest production ratio of HBM3E among all HBM products at least until the first half of next year, indicating a shift in focus due to strong demand for existing HBM3E-equipped chips [4] Group 2 - There are concerns in the industry regarding potential delays in the mass production of NVIDIA's Rubin chip, attributed to increasing complexity in HBM4 technology and bottlenecks in TSMC's 2.5D packaging technology [4] - SK Hynix has ramped up the production of HBM3E significantly, exceeding expectations, in response to discussions with NVIDIA about next year's HBM production [4]