昆仑芯将赴港上市
BIDUBIDU(US:BIDU) 半导体芯闻·2025-12-16 10:57

Core Viewpoint - Kunlun Core, a self-developed chip project under Baidu, is accelerating its path to IPO following its upcoming share reform [1][3]. Group 1: Company Overview - Kunlun Core was established in 2011 and began independent financing in 2021, with Ouyang Jian as CEO [1]. - Baidu is the controlling shareholder of Kunlun Core, which has completed six rounds of financing, the latest in July this year [1]. Group 2: Product Development - The main product of Kunlun Core is the P800 chip, set to launch in 2024, which has been validated within Baidu's operations [1]. - In the first half of this year, Baidu activated a 30,000-card cluster based on the P800 chip, achieving high cost-performance in training a multimodal model [1]. Group 3: Future Product Roadmap - Kunlun Core plans to release the M100 chip in 2026, optimized for large-scale inference scenarios, and the M300 chip in 2027, aimed at ultra-large multimodal model training and inference [1][3]. - Baidu will launch the "Tianchi 256 Super Node" in the first half of 2026, which supports 256 interconnected cards, enhancing total interconnect bandwidth by four times and improving performance by over 50% compared to the previous model [3]. - The "Tianchi 512 Super Node" is expected in the second half of 2026, supporting 512 interconnected cards and capable of training trillion-parameter models [3]. Group 4: Long-term Vision - According to Baidu's roadmap, Kunlun Core anticipates launching a new generation of N series chips by 2029 and achieving a million-card Kunlun Core single cluster by 2030 [4].

昆仑芯将赴港上市 - Reportify