华海清科CMP设备：出货800台

Core Viewpoint - The company, Huahai Qingke, has achieved significant milestones in the Chemical Mechanical Polishing (CMP) equipment sector, with over 800 units delivered, indicating strong market recognition and a leading position in domestic CMP equipment [2]. Group 1: Company Achievements - The company has successfully delivered more than 800 CMP equipment units, including key models like Universal-H300 and Universal-S300, covering major product lines such as logic, 3D NAND storage, and DRAM storage [2]. - The company has penetrated advanced sectors including large wafers, third-generation semiconductors, CIS, MEMS, MicroLED, and advanced packaging, achieving full coverage of domestic integrated circuit manufacturing lines [2]. - The recognition of the company's technology, product maturity, and reliability has enhanced its market influence and solidified its position as a domestic leader in CMP equipment [2]. Group 2: Market Opportunities and Strategies - The advancement of AI technology in algorithm architecture and computing power is creating opportunities for deep development in advanced packaging and chip stacking technologies [3]. - The CMP equipment can synergize with the company's thinning, cutting, and edge polishing equipment, providing comprehensive solutions for advanced packaging and chip stacking, thus expanding future application scenarios [3]. - The company's strategy of "equipment + service" is expected to enhance the volume of key consumables and maintenance services, contributing to stable profit growth [3]. Group 3: Future Directions - The company plans to continue focusing on independent innovation in core technologies and increase R&D investment, targeting breakthroughs in advanced processes and upgrading existing product systems [3]. - The company aims to closely track trends in advanced packaging technologies like HBM and CoWos, promoting product innovation and category expansion to seize opportunities in the integrated circuit industry [3].